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Part No. | Data Rate | Fiber | Distance | Temp. | DDMI | CMIS |
AAQD2QP2400Cxxx | 425Gbps | MMF | 1-30m | 0~+70℃ | Yes | CMIS4.0 |
Note: xxx means meters.eg. 001 is 1m, max is 30m.s
Absolute Maximum Ratings
Parameter | Symbol | Min. | Max. | Unit |
Storage Temperature | Ts | -40 | 85 | °C |
Supply Voltage | Vcc | -0.5 | 3.6 | V |
Operating Relative Humidity | RH | 5 | 85 | % |
Recommended Operating Conditions
Parameter | Symbol | Min. | Typical | Max. | Unit |
Operating Case Temperature | Tc | 0 | 70 | °C | |
Power Supply Voltage | Vcc | 3.135 | 3.3 | 3.465 | V |
Power Supply Noise | 25 | mVpp | |||
Receiver Differential Data Output Load | 100 | Ohm | |||
Fiber Length (MMF) | 30 | m | |||
Bit Error Rate (26.5625GBd PAM4) | BER | 2.4E- 4 |
Figure 1: AOC Block Diagram
Figure 2: Application Reference Diagram
As shown in Figure 1, the transmitter path of the AOC (QSFP56-DD end) contains an 8x53.125Gbps 400GAUI-8 electrical input with Equalization (EQ) block, two 4-channel laser drivers and multi-mode laser source. And the transmitter path of the AOC (QSFP56 end) contains an 4x53.125Gbps 200GAUI-4 electrical input with Equalization (EQ) block, one 4-channel laser driver and multi-mode laser source.
As shown in Figure 1, the receiver path of the AOC (QSFP56-DD end) contains eight PIN photodiodes, two 4- channel trans-impedance amplifiers (TIA) and integrated 400GAUI-8 compliant electrical output blocks. And the receiver path of the AOC (QSFP56 end) contains four PIN photodiodes, one 4-channel trans-impedance amplifier (TIA) and integrated 200GAUI-4 compliant electrical output block.
The interface between QSFP56-DD/QSFP56 module and ASIC/SerDes is shown in Figure 2. The high speed signal lines are internally AC-coupled and the electrical inputs are internally terminated to 100 ohms’ differential. All transmitter and receiver electrical channels are compliant to module 400GAUI-8 and 200GAUI-4 specifications per IEEE 802.3bs.
The control signal interface is compliant with QSFP56-DD and QSFP56 MSA. The following pin is provided to control module or display the module status: ModSelL, ResetL, LPMode, ModPrsL and IntL. In addition, there is an industry standard two wire serial interface scaled for 3.3V LVTTL. The definition of control signal interface and the registers of the serial interface memory are defined in the Control Interface & Memory Map section.
The AOC module may be damaged immediately by exposure to current surges and over voltage events. Care should be taken to restrict exposure to the conditions defined in the Absolute Maximum Ratings. Wave soldering, reflow soldering and/or aqueous wash process with the modules on board are not recommended. Normal handling precautions for electrostatic discharge sensitive devices should be observed.
General Electrical Characteristics
Parameter | Symbol | Min. | Typical | Max. | Unit |
AOC Power Consumption (QSFP56-DD End) | 10 | W | |||
AOC Power Consumption (QSFP56 End) | 5 | W | |||
AOC Power Supply Total Current (QSFP56-DD End) | 2886 | mA | |||
AOC Power Supply Total Current (QSFP56 End) | 1515 | mA | |||
AC Coupling Internal Capacitor | 0.1 | μF |
Test Point | Description |
TP0 to TP5 | This channel includes transmitter and receiver differential control impedance printed circuit board insertion loss and cable assembly insertion loss. |
TP1 to TP4 | All cable assembly measurements are made between TP1 and TP4 as illustrated in Figure 3. |
TP0 to TP2 TP3 to TP5 | A mated connector pair has been included in both the transmitter and receiver specifications defined in 802.3cd 136.9.3 and 136.9.4. The recommended maximum insertion loss from TP0 to TP2 or from TP3 to TP5 including the test fixture is provided in 802.3cd 136.9.3.2 |
TP2 | Unless specified otherwise, all transmitter measurements defined in 802.3cd 136.9.3 are made at TP2 utilizing the test fixture specified in Annex 136B. |
TP3 | Unless specified otherwise, all receiver measurements and tests defined in 802.3cd 136.9.4 are made at TP3 utilizing the test fixture specified in Annex 136B. |
Figure 3: IEEE 802.3cm Block Diagram for 400GBASE-SR8 Transmit/Receive Paths
Figure 4: IEEE 802.3cd Block Diagram for 200GBASE-SR4 Transmit/ReceivePaths
Figure 5: IEEE 802.3bs 400GAUI-8/200GAUI-4 C2M Compliance Points TP1a, TP4a
Figure 6: IEEE 802.3bs 400GAUI-8/200GAUI-4 C2M Compliance Points TP1, TP4
Parameter | Test Point | Min. | Typical | Max. | Unit |
Signaling Rate per Lane | TP1 | 26.5625± 100ppm | GBd | ||
Differential peak-peak Input Voltage Tolerance | TP1a | 900 | mV | ||
Differential Input Return Loss | TP1 | Equation (83E-5) | dB | ||
Common To Differential Mode Conversion Return Loss | TP1 | Equation (83E-6) | dB | ||
Differential Termination Mismatch | TP1 | 10 | % | ||
Single-Ended Voltage Tolerance Range | TP1a | -0.4 | 3.3 | V | |
DC Common-Mode Output Voltage | TP1 | -350 | 2850 | mV | |
Module Stressed Input Test | TP1a | ||||
Eye Width | 0.22 | UI | |||
Applied peak-peak Sinusoidal Jitter | Table 120E- 6 | ||||
Eye Height | 32 | mV |
High Speed Electrical Output Characteristics
ParamPareter | Test Point | Min. | Typical | Max. | Unit |
Signaling Rate per Lane | TP4 | 26.5625± 100ppm | GBd | ||
AC Common-Mode Output Voltage (RMS) | TP4 | 17.5 | mV | ||
Differential Peak-to-Peak Output Voltage | TP4 | 900 | mV | ||
Near-end ESMW (Eye Symmetry Mask Width) |
TP4 |
0.265 |
UI | ||
Near-end Eye Height, Differential |
TP4 |
70 |
mV | ||
Differential Output Return Loss | TP4 | Equation (83E-2) | |||
Common to Differential Mode Conversion Return Loss | TP4 | Equation (83E-3) | |||
sDifferential Termination Mismatch | TP4 | 10 | % | ||
Transition Time (20% ~80%) | TP4 | 9.5 | ps | ||
DC Common Mode Voltage | TP4 | -350 | 2850 | mV |
QSFP56-DD End Electrical Pad Layout
Pin Descriptions
Pin | Logic | Symbol | Description | Plug Sequence4 | Notes | ||||||||
1 | GND | Ground | 1B | 1 | |||||||||
2 | CML-I | Tx2n | Transmitter Inverted Data Input | 3B | |||||||||
3 | CML-I | Tx2p | Transmitter Non- Inverted Data Input | 3B | |||||||||
4 | GND | Ground | 1B | 1 | |||||||||
5 | CML-I | Tx4n | Transmitter Inverted Data Input | 3B | |||||||||
6 | CML-I | Tx4p | Transmitter Non- Inverted Data Input | 3B | |||||||||
7 | GND | Ground | 1B | 1 | |||||||||
8 | LVTTL-I | ModSelL | Module Select | 3B | |||||||||
9 | LVTTL-I | ResetL | Module Reset | 3B | |||||||||
10 | VccRx | +3.3V Power Supply Receiver | 2B | 2 | |||||||||
11 | LVCMOS- I/O | SCL | 2-wire serial interface clock | 3B | |||||||||
12 | LVCMOS- I/O | SDA | 2-wire serial interface data | 3B | |||||||||
13 | GND | Ground | 1B | 1 | |||||||||
14 | CML-O | Rx3p | Receiver Non- | 3B | |||||||||
Inverted Data Output | |||||||||||||
15 | CML-O | Rx3n | Receiver Inverted Data Output | 3B | |||||||||
16 | GND | Ground | 1B | 1 | |||||||||
17 | CML-O | Rx1p | Receiver Non- | 3B | |||||||||
18 | CML-O | Rx1n | Receiver Inverted | 3B | |||||||||
Data Output | |||||||||||||
19 | GND | Ground | 1B | 1 | |||||||||
20 | GND | Ground | 1B | 1 | |||||||||
21 | CML-O | Rx2n | Receiver Inverted | 3B | |||||||||
Data Output | |||||||||||||
22 | CML-O | Rx2p | Receiver Non- | 3B | |||||||||
Inverted Data Output | |||||||||||||
23 | GND | Ground | 1B | 1 | |||||||||
24 | CML-O | Rx4n | Receiver Inverted Data Output | 3B | |||||||||
25 | CML-O | Rx4p | Receiver Non- Inverted Data | 3B | |||||||||
Output | |||||||||||||
26 | GND | Ground | 1B | 1 | |||||||||
27 | LVTTL-O | ModPrsL | Module Present | 3B | |||||||||
28 | LVTTL-O | IntL | Interrupt | 3B | |||||||||
29 | VccTx | +3.3V Power supply | 2B | 2 | |||||||||
transmitter | |||||||||||||
30 | Vcc1 | +3.3V Power supply | 2B | 2 | |||||||||
31 | LVTTL-I | PLMode | Low Power Mode | 3B | |||||||||
32 | GND | Ground | 1B | 1 | |||||||||
33 | CML-I | Tx3p | Transmitter Non- | 3B | |||||||||
Inverted Data Input | |||||||||||||
34 | CML-I | Tx3n | Transmitter | 3B | |||||||||
Inverted Data Input | |||||||||||||
35 | GND | Ground | 1B | 1 | |||||||||
36 | CML-I | Tx1p | Transmitter Non- | 3B | |||||||||
Inverted Data Input | |||||||||||||
37 | CML-I | Tx1n | Transmitter | 3B | |||||||||
Inverted Data Input | |||||||||||||
38 | GND | Ground | 1B | 1 | |||||||||
39 | GND | Ground | 1A | 1 | |||||||||
40 | CML-I | Tx6n | Transmitter | 3A | |||||||||
Inverted Data Input | |||||||||||||
41 | CML-I | Tx6p | Transmitter Non- | 3A | |||||||||
Inverted Data Input | |||||||||||||
42 | GND | Ground | 1A | 1 | |||||||||
43 | CML-I | Tx8n | Transmitter | 3A | |||||||||
Inverted Data Input | |||||||||||||
44 | CML-I | Tx8p | Transmitter Non- Inverted Data Input | 3A | |||||||||
45 | GND | Ground | 1A | 1 | |||||||||
46 | Reserved | For future use | 3A | 3 | |||||||||
47 | VS1 | Module Vendor Specific 1 | 3A | 3 | |||||||||
48 | VccRx1 | 3.3V Power Supply | 2A | 2 | |||||||||
49 | VS2 | Module Vendor | 3A | 3 | |||||||||
Specific 2 | |||||||||||||
50 | VS3 | Module Vendor | 3A | 3 | |||||||||
Specific 3 | |||||||||||||
51 | GND | Ground | 1A | 1 | |||||||||
52 | CML-O | Rx7p | Receiver Non- | 3A | |||||||||
Inverted Data Output | |||||||||||||
53 | CML-O | Rx7n | Receiver Inverted Data Output | 3A | |||||||||
54 | GND | Ground | 1A | 1 | |||||||||
55 | CML-O | Rx5p | Receiver Non- | 3A | |||||||||
Inverted Data | |||||||||||||
Output | |||||||||||||
56 | CML-O | Rx5n | Receiver Inverted | 3A | |||||||||
Data Output | |||||||||||||
57 | GND | Ground | 1A | 1 | |||||||||
58 | GND | Ground | 1A | 1 | |||||||||
59 | CML-O | Rx6n | Receiver Inverted | 3A | |||||||||
Data Output | |||||||||||||
60 | CML-O | Rx6p | Receiver Non- | 3A | |||||||||
Inverted Data | |||||||||||||
Output | |||||||||||||
61 | GND | Ground | 1A | 1 | |||||||||
62 | CML-O | Rx8n | Receiver Inverted Data Output | 3A | |||||||||
63 | CML-O | Rx8p | Receiver Non- Inverted Data | 3A | |||||||||
Output | |||||||||||||
64 | GND | Ground | 1A | 1 | |||||||||
65 | NC | No Connect | 3A | 3 | |||||||||
66 | Reserved | For future use | 3A | 3 | |||||||||
67 | VccTx1 | 3.3V Power Supply | 2A | 2 | |||||||||
68 | Vcc2 | 3.3V Power Supply | 2A | 2 | |||||||||
69 | Reserved | For Future Use | 3A | 3 | |||||||||
70 | GND | Ground | 1A | 1 | |||||||||
71 | CML-I | Tx7p | Transmitter Non- | 3A | |||||||||
Inverted Data Input | |||||||||||||
72 | CML-I | Tx7n | Transmitter Inverted Data Input | 3A | |||||||||
73 | GND | Ground | 1A | 1 | |||||||||
74 | CML-I | Tx5p | Transmitter Non- Inverted Data Input | 3A | |||||||||
75 | CML-I | Tx5n | Transmitter Inverted Data Input | 3A | |||||||||
76 | GND | Ground | 1A | 1 | |||||||||
1: QSFP-DD uses common ground (GND) for all signals and supply (power). All are common within the QSFP -DD module and all module voltages are referenced to this potential unless otherwise noted. Connect these directly to the host board signal-common ground plane. | |||||||||||||
2: VccRx, VccRx1, Vcc1, Vcc2, VccTx and VccTx1 shall be applied concurrently. VccRx, VccRx1, Vcc1, Vcc2, VccTx and VccTx1 may be internally connected within the module in any combination. The connector Vcc pins are each rated for a maximum current of 1000 mA. | |||||||||||||
3: All Vendor Specific, Reserved and No Connect pins may be terminated with 50 ohms to ground on the host. Pad 65 (No Connect) shall be left unconnected within the module. Vendor specific and Reserved pads shall have an impedance to GND that is greater than 10 k Ohms and less than 100 pF. | |||||||||||||
4: Plug Sequence specifies the mating sequence of the host connector and module. The sequence is 1A, 2A, 3A, 1B, 2B, 3B. Contact sequence A will make, then break contact with additional QSFP-DD pads. Sequence 1A, 1B will then occur simultaneously, followed by 2A, 2B, followed by 3A, 3B. | |||||||||||||
QSFP56 End Electrical Pad Layout
Pin Descriptions
Pin | Logic | Symbol | Description | Plug Sequence | Notes | ||||||||
1 | GND | Ground | 1 | 1 | |||||||||
2 | CML-I | Tx2n | Transmitter Inverted Data Input | 3 | |||||||||
3 |
CML-I |
Tx2p | Transmitter Non-Inverted Data Input |
3 | |||||||||
4 | GND | Ground | 1 | 1 | |||||||||
5 | CML-I | Tx4n | Transmitter Inverted Data Input | 3 | |||||||||
6 |
CML-I |
Tx4p | Transmitter Non-Inverted Data Input |
3 | |||||||||
7 | GND | Ground | 1 | 1 | |||||||||
8 | LVTTL-I | ModSelL | Module Select | 3 | |||||||||
9 | LVTTL-I | ResetL | Module Reset | 3 | |||||||||
10 | VccRx | +3.3V Power Supply Receiver | 2 | 2 | |||||||||
11 | LVCMOS - I/O |
SCL |
2-wire serial interface clock |
3 | |||||||||
12 | LVCMOS - I/O |
SDA |
2-wire serial interface data |
3 | |||||||||
13 | GND | Ground | 1 | 1 | |||||||||
14 |
CML-O |
Rx3p | Receiver Non-Inverted Data Output |
3 | |||||||||
15 | CML-O | Rx3n | Receiver Inverted Data Output | 3 | |||||||||
16 | GND | Ground | 1 | 1 | |||||||||
17 |
CML-O |
Rx1p | Receiver Non-Inverted Data Output |
3 | |||||||||
18 | CML-O | Rx1n | Receiver Inverted Data Output | 3 | |||||||||
19 | GND | Ground | 1 | 1 | |||||||||
20 | GND | Ground | 1 | 1 | |||||||||
21 | CML-O | Rx2n | Receiver Inverted Data Output | 3 | |||||||||
22 |
CML-O |
Rx2p | Receiver Non-Inverted Data Output |
3 | |||||||||
23 | GND | Ground | 1 | 1 | |||||||||
24 | CML-O | Rx4n | Receiver Inverted Data Output | 3 | |||||||||
25 |
CML-O |
Rx4p | Receiver Non-Inverted Data Output |
3 | |||||||||
26 | GND | Ground | 1 | 1 | |||||||||
27 | LVTTL-O | ModPrsL | Module Present | 3 | |||||||||
28 | LVTTL-O | IntL | Interrupt | 3 | |||||||||
29 | VccTx | +3.3V Power supply transmitter | 2 | 2 | |||||||||
30 | Vcc1 | +3.3V Power supply | 2 | 2 | |||||||||
31 | LVTTL-I | LPMode | Low Power Mode | 3 | |||||||||
32 | GN | D | Ground | 1 1 | |||||||||
33 | CML-I Tx | 3p Transmitt | er Non-Inverted Data | 3 | |||||||||
34 | CML-I | Tx3n | Transmitter Inverted Data Input | 3 | |||||||||
35 | GND | Ground | 1 | 1 | |||||||||
36 |
CML-I |
Tx1p | Transmitter Non-Inverted Data Input |
3 | |||||||||
37 | CML-I | Tx1n | Transmitter Inverted Data Input | 3 | |||||||||
38 | GND | Ground | 1 | 1 | |||||||||
1: GND is the symbol for signal and supply (power) common for the QSFP56 module. All are common within the QSFP56 module and all module voltages are referenced to this potential unless otherwise noted. Connect these directly to the host board signal-common ground plane. | |||||||||||||
2: Vcc Rx, Vcc1 and Vcc Tx are the receiver and transmitter power supplies and shall be applied concurrently. Requirements defined for the host side of the Host Edge Card Connector are listed in SFF-8679 Table 6. Recommended host board power supply filtering is shown in Figures 12. Vcc Rx, Vcc1 and Vcc Tx may be internally connected within the QSFP56 Module in any combination. | |||||||||||||
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Copyright 2022 ATI. All rights reserved.
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